eletvya@nus.edu.sg

Voon Yew Thean

Singapore
Professor

Postgraduate:

University of Illinois at Urbana-Champaign
United States

Main Appointment:

College of Design and Engineering (Electrical & Computer Engineering)

Joint Appointments:

Research Fields:

[supervisor_research_field]

Research Areas:

[supervisor_research_area]

Research Fields:

  • STEMM – Science, Technology, Engineering, Mathematics, Medical Sciences

Research Keywords:

  • Semiconductor Chip Technology
  • Microelectronics
  • Artificial Intelligence Hardware
  • Biosensors
  • Heterogeneous Integration

Current Appointments:

Dean, College of Design and Engineering
Director, Singapore Next-Generation Micro-Electronics Center (SHINE) (NRF Mid-Sized Research Center)
Director, E6Nanofab (Nanofabrication Center)

Brief Description of Research:

Disruptive Materials-System Co-Innovation for Micro-/Nano-Electronics (Interdisciplinary)
Next-Generation AI/ML Hardware-Software Co-optimization
Microelectronics- and AI- Enabled Bio-sensing (Interdisciplinary)
Advanced Semiconductor Technologies
Next-Generation Heterogeneous Integration Technologies

Total Number of Publications:

300

Five Representative Publications:

1. Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing B Tang, et. al., …Nature Communications 13 (1), 1-9
2. Engineered Nucleotide Chemicapacitive Microsensor Array Augmented with Physics‐Guided Machine Learning for High‐Throughput Screening of Cannabidiol SHK Yap, et. al., …Small, 2107659
3. A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array H Veluri, et. al. IEEE Transactions on Neural Networks and Learning Systems
4. Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistors J Pan, et. al. …ACS Applied Nano Materials 4 (7), 6903-6915
5. All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration M Sivan, et. al. …Nature communications 10 (1), 1-12

My Research Videos:

Top 5 Publications:

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Journals Published:

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Voon Yew Thean

Professor
College of Design and Engineering (Electrical & Computer Engineering)
Singapore
eletvya@nus.edu.sg

Appointments

Dean, College of Design and Engineering
Director, Singapore Next-Generation Micro-Electronics Center (SHINE) (NRF Mid-Sized Research Center)
Director, E6Nanofab (Nanofabrication Center)

Education

University of Illinois at Urbana-Champaign
United States

Research Areas

  • Semiconductor Chip Technology
  • Microelectronics
  • Artificial Intelligence Hardware
  • Biosensors
  • Heterogeneous Integration

Research Description

Disruptive Materials-System Co-Innovation for Micro-/Nano-Electronics (Interdisciplinary)
Next-Generation AI/ML Hardware-Software Co-optimization
Microelectronics- and AI- Enabled Bio-sensing (Interdisciplinary)
Advanced Semiconductor Technologies
Next-Generation Heterogeneous Integration Technologies

Research Videos

Selected Publications

(out of 300 publications)

1. Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing B Tang, et. al., …Nature Communications 13 (1), 1-9
2. Engineered Nucleotide Chemicapacitive Microsensor Array Augmented with Physics‐Guided Machine Learning for High‐Throughput Screening of Cannabidiol SHK Yap, et. al., …Small, 2107659
3. A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array H Veluri, et. al. IEEE Transactions on Neural Networks and Learning Systems
4. Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistors J Pan, et. al. …ACS Applied Nano Materials 4 (7), 6903-6915
5. All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration M Sivan, et. al. …Nature communications 10 (1), 1-12